3rd Optical Interconnect in Data Centers Symposium

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29 September 2015, Valencia, Spain (co-located with ECOC)
Feria Valencia Convention and Exhibition Centre (CCE), Room Joaquin Rodrigo Suite 1

Register here.

 

The 3rd Optical Interconnect in Data Centers Symposium takes place on the 29th of September 2015 in Valencia/Spain.

The symposium is focused on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in data center and high-performance computing systems: on-board, board-to-board and rack-to-rack.

Registration: the event is free but pre-registration is mandatory. Registration includes admission to symposium sessions, coffee breaks, lunch, and a copy of the presentations.

Symposium updates can be followed also on:

@PhoxTroT_EU#PhoxTroT_Symposium

Agenda 3rd PhoxTroT Symposium (pdf)

 

Tuesday 29 September 2015

 

8:15

  WELCOME

  by PhoxTroT

8:30 – 10:30

  CLOUD DATA CENTERS

  Session Chair: Emmanouel Varvarigos

8:30

  Lê Nguyên Bình,

Modulation and interconnection for Exa/Zeta-bps optical Networks’

Technical Director, European Research Centre, Huawei Technologies, Germany

8:50

  Katharine Schmidtke,

Facebook network architecture and its impact on interconnects’

Strategic Sourcing Manager, Optical Technology, Facebook, United States

9:10

  Richard Pitwon,

Evolution of optical interconnect technologies and architectures for exascale data centres’

Director, Photonics Research and Development, Cloud Systems & Solutions, Seagate Technology, United Kingdom

9:30

  Peter J. Winzer,

High-Capacity Systems for Mega-Datacenter Interconnects’

Head the Optical Transmission Systems and Networks Research Department, Bell Labs, NJ, United States

9:50

  Kazuhiko Kurata,

Next gen datacenter interconnects, the challenges from a manufacturers perspective’

Senior Manager, Nano Electronics Research Labs., NEC Corporation, Japan

10:10

  Round table discussion

   

10:30

  Coffee Break

 

10:50 – 13:00

  EMBEDDED OPTICAL MODULES FOR DATA CENTERS

  Session Chair: Andreas Hakansson

10:50

  Jeroen Duis,

A glimpse into the PhoxTroT AOC technology’

Technology Incubator and Team Leader, Optics Future Technology Center EMEA,
TE Connectivity, Netherlands

11:10

  Thomas H. Toifl,

ADDAPT – Adaptive data and power aware transceivers for 56Gb/s ultra-low power optical links’

Manager I/0 Link Technology, IBM Zürich, Switzerland

11:30

  Elad Mentovich,

LinkX surprises for 100Gb/s and above, what can we tell?’

Principal Engineer , Process Technologies, Mellanox Technologies, Israel

11:50

  Peter De Dobbelaere,

Reduced power dissipation for optical interconnect by closer onto-electronic integration’

Vice President of Engineering, Luxtera, CA, United States

12:10

  Hideyuki Nasu,

Polymer waveguide-coupled solderable optical modules for high-density optical interconnects’

Product Manager, Furukawa Electric, Japan

12:30

  Round table discussion

   

13:00

  Lunch

 

14:00 – 16:00

  COMPONENTS & SYSTEMS FOR DATA CENTERS

  Session Chair: Dimitris Apostolopoulos

14:00

  Christian Neumeyr,

Long-wavelength VCSELs for advanced optical communications systems’

Chief Executive Officer, Vertilas, Germany

14:20

  Antoine Brimont,

Are Electro-optic silicon photonic modulators and switches ready for demanding applications?’

Senior Research Engineer, UPV – Valencia Nanophotonics Technology Center, Spain

14:40

  Takaaki Ishigure,

Polymer waveguide for 3-D on-board optical circuits’

Professor, Dept. of Applied Physics and Physico-Informatics, Keio University, Japan

15:00

  Domenico Tulli,

PhoxTroT: Single-mode optical interconnect platform’

Senior Photonic Engineer, Das Photonics, Spain

15:20

  Ronald Broeke,

PIC design across platforms’

CEO, Bright Photonics, Netherlands

15:40

  Round table discussion

   

16:00

  Coffee Break

 

16:20 – 18:30

  PHOTONICS INTEGRATION FOR DATA CENTERS

  Session Chair: Nikos Pleros

16:20

  Marika Immonen,

On-board optical interconnects development in PhoxTroT’

Manager of R&D Optical Interconnects, TTM Technologies, Finland

16:40

  Jochen Kraft,

Manufacturing of 3D-integrated Optoelectronic and Photonic ICs and Systems’

Principal Development Engineer, ams, Austria

17:00

  Guang-Hua Duan and Benoit Charbonnier,

Hybrid III-V Silicon Photonic Integrated Circuits for Optical Interconnect’

Team Manager, III-V Lab and CEA LETI, France

17:20

  Lars Zimmermann,

Photonic BiCMOS – a silicon photonic integration platform for high-speed communications’

Team Leader Silicon Photonics Technologies ,IHP, Germany

17:40

  Arjen Bakker,

An integral approach to PIC design – software, libraries and design kits’

CTO, PhoeniX Software, Netherlands

18:00

  Round table discussion

18:30

  END OF SYMPOSIUM

 

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